Samsung 980 PRO 1TB SSD Disk/ M.2 2280 PCIe 4.0/ with Heat Sink/ Compatible with PS5 and PC

Compatibility

PC + PS5

Heatsink

Thermal protection

The CPCI 4.0

Interface

Sequential read speed of 7000 MB/s

Intelligent thermal control

High performance SSDs require high performance thermal control. The 980 PRO with heat sink uses Samsung's own high-end nickel-coated controller to provide effective thermal control of the NAND chip. With the added heat sink, play with confidence on PlayStation® 5 game consoles and PC systems without worrying about sudden drops in performance from overheating.

• General feature
• Type of product
• For the purposes of this Regulation, the following definitions shall apply:
• Family line
• 980 PRO with heat sink SSD PCIe® 4.0 NVMeTM
• Capacity
• 1TB
• Interface
• For the purposes of this Regulation:
• Compatibility
• PC and Playstation 5
• Performance
• Encrypted
• The following information shall be provided by the manufacturer:
• Interface
• CPE Gen 4.0 x4, NVMe 1.3c
• Read/write speeds
• For the purposes of this Regulation:
• Application of use
• Client PCs, game consoles
• Storage
• Capacity
• 1000 GB (1 GB = 1 billion bytes per IDEMA) * Actual usable capacity may be lower (due to formatting, partitioning, operating system, applications or others)
• Key features
• Sequential reading speed
• Up to 7000 MB/s * Performance may vary depending on hardware and system configuration
• Sequential write speed
• Up to 5000 MB/s * Performance may vary depending on hardware and system configuration
• Compatibility
• 980 PRO is backwards compatible with PCIe 3.0. Sequential throughput (up to): 3450 MB/s (1 TB), 3470 MB/s (2 TB) for writing. Random (up to): 690 000 IOPS (1 TB), 680 000 IOPS (2 TB) for reading, 660 000 IOPS (1 TB), 630 000 IOPS (2 TB) for writing.
• Cache memory
• Samsung SDRAM DDR4 with low power consumption of 1 GB
• Cutting support
• Supported
• Intelligent support
• Supported
• GC (waste collection)
• Automatic waste collection algorithm
• Compatibility with the suspension mode of the device
• i did
• Thermal protection
• Heat exchanger
• General
• Average power consumption (system level)
• * Average: 6.2 W* Maximum: 8.9 W (burst mode) * Actual power consumption may vary depending on hardware and system configuration
• Energy consumption (inactive)
• max. 35 mW * Actual power consumption may vary depending on hardware and system configuration
• Reliability (MTBF)
• Reliability of 1,5 million hours (MTBF)
• Environmental specifications
• Shock
• 1500 G and 0,5 ms (half-breast)
• Form factor
• M.2 (2280) with heat sink complying with PCI-SIG® D8 standard
• Dimensions (An. x Al. x Pr.)
• 24 x 80 x 8,6 mm (with heat sink)
• Weight
• not more than 30,5 g